Murata launches vibration sensor device for predictive maintenance capable of detecting high-frequency range up to 20 kHz
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Murata launches vibration sensor device for predictive maintenance capable of detecting high-frequency range up to 20 kHz

　　Murata Manufacturing Co., Ltd. announces the SMD-type vibration sensor device PKGM-210D-R. Mass production has already begun.　　In the factory automation (FA) industry, maintenance has traditionally consisted of scheduled maintenance at fixed intervals and corrective maintenance after failures.　　In recent years, however, predictive maintenance, which detects early signs of failure to prevent unexpected equipment stoppages, has become increasingly important. In rotary machinery such as bearings and motors, component damage or insufficient lubrication generates minute abnormal vibrations in the high-frequency range up to 20 kHz before failures become serious. Measuring such high-frequency vibrations is challenging due to interference from noise, and detection has often relied on the experience of skilled technicians using auditory inspection.　　By combining its long-established piezoelectric ceramic vibration detection technology with advanced circuit packaging expertise, Murata has developed the PKGM-210D-R, capable of detecting vibrations up to 20 kHz, the upper limit of the audible range. This enables detection of subtle high-frequency abnormal vibrations that were previously identified only by human hearing.　　The product supports early prediction of equipment issues, helping to reduce downtime, optimize maintenance timing, extend component life, and minimize excess inventory. In addition, its compact size of 0.20 × 0.20 × 0.14 inches (5.0 × 5.0 × 3.5 mm) allows easy retrofitting to existing equipment or direct integration into motor components.　　Key features:　　Z-axis direction detection up to 20 kHz　　Compact size (0.20 × 0.20 × 0.14 inch / 5.0 × 5.0 × 3.5 mm) for easy retrofit and built-in mounting　　Built-in driver and filter circuits　　Versatile single analog output　　Built-in temperature sensor
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Release time：2026-03-19 17:06 reading：245 Continue reading>>
Renesas Announces General Availability of Renesas 365
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Renesas Announces General Availability of Renesas 365

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the general availability of Renesas 365, Powered by Altium, an intelligent, model-based platform that integrates device exploration, model-based system development and early concept validation on a single unified platform. Built on a cloud environment, Renesas 365 is an industry-first platform designed to bring silicon and systems together across an open ecosystem at scale.　　In modern embedded design, engineers often struggle with disconnected workflows, manual component searches and limited system-level awareness. Renesas 365 directly addresses such challenges by connecting previously isolated tools such as embedded software files, datasheets and application notes into a streamlined, cloud-managed platform. With Renesas 365, engineering teams can collaboratively explore architectures, co-develop hardware and software and make system-level design decisions backed by real-time insights.　　Following its concept introduction, Renesas is now launching the first phase of Renesas 365 by integrating over 550 variants of the RA family of microcontrollers (MCUs), an industry-leading Arm®-based MCU portfolio together with a full suite of development tools.　　Using model-based evaluation and optimization technology, engineers can now rely on Renesas 365 as an intelligent design environment that actively assists with selecting the right MCU based on full system requirements. Rather than filtering datasheets in isolation, engineers receive guided recommendations informed by pin usage, peripherals, timing, power and how devices align with system building blocks. This means tasks that typically take an engineer an hour reviewing data sheets and tool requirements can now be accomplished in minutes, dramatically reducing evaluation time. This system-level intelligence accelerates design convergence, minimizes downstream rework and enables faster time to market while supporting more robust, efficient and cost-effective embedded designs.　　“The general availability of Renesas 365 marks a pivotal milestone in realizing Renesas’ Digitalization Vision,” said Gaurang Shah, Vice President and General Manager of Embedded Processing at Renesas. “By delivering the first phase of an intelligent design environment that supports early-stage development, we are laying the groundwork for the next phase, where hardware and software subsystem elements will be maintained within Renesas 365. This helps our customers build, scale and sustain next-generation software-defined products faster and at lower cost.”　　Together with the e²studio integrated development environment (IDE), Flexible Software Package (FSP) and smart documentation, engineers can leverage integrated design workflows specifically created for RA MCU devices, including sensing, power management and compiler support.　　Key features of Renesas 365 include:　　Model-based component and system exploration, discovery and selection　　Digital continuity across systems, hardware and software workflows　　AI-assisted guidance on design constraints, resource management, and error resolution　　Over-the-air (OTA) device management for RA MCUs　　Existing customers can link their current projects in e²studio with Renesas 365 and start using the platform immediately, while developers starting a new project are guided through system-level component and solution discovery to identify compatible devices and evaluate feasibility. This system-level context awareness significantly accelerates early-stage development and reduces iterations.　　Digitally Connected Hardware and Software Configurations　　As engineers make modifications to their system, the platform automatically records iterations and connects them with system-level design elements so teams can revisit any previous hardware and software configurations. With a context-aware smart system, Renesas 365 helps identify resource or design constraints, suggests resolutions and assists teams to make design decisions with fewer iterations and confidence. Moreover, Renesas 365 lets customers manage and update RA-based devices even after initial design through an integrated over-the-air (OTA) capability.　　An Open Platform Built for Flexibility　　Renesas 365 is an open, scalable platform that mirrors how electronic systems are developed in the real world. Developers have the option to incorporate third-party components, sensors and partner tools directly into their system designs. This open approach allows teams to evaluate tradeoffs and consider mixed vendor architectures to customize solutions with integrated system-level context.　　Growing the Renesas 365 Ecosystem　　Now under development, the next phase of Renesas 365 will pave the way for completed subsystem building blocks to be modeled as platform-maintained components. As part of this effort, more Renesas product families will be supported, and the component ecosystem will include more third-party devices. Subsystem components such as peripheral configuration, power management and software will be automatically defined, maintained and validated for compatibility. With these customizable building blocks, customers will accelerate time to market, reduce engineering effort, and gain access to cutting-edge technologies.　　Renesas will showcase Renesas 365 at embedded world 2026 in Nuremberg in two separate locations.　　Renesas 365 Booth (Hall 4, Stand 305/4-305): Dedicated to the Renesas 365 solution, Booth 4-305 will feature live demonstrations on integrated RA workflows, model-based system exploration and intelligent validation.　　Renesas Booth (Hall 1, Stand 234/1-234): Showcasing products across Renesas’ comprehensive portfolio of leading-edge semiconductor solutions with presentations and demos.
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Release time：2026-03-18 13:11 reading：233 Continue reading>>
MWC 2026 | Fibocom Unveils <span style='color:red'>AI</span> ECR Solution, Ushering in a New Era of Smart Retail
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MWC 2026 | Fibocom Unveils AI ECR Solution, Ushering in a New Era of Smart Retail

　　At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail scenarios.　　Powered by MediaTek’s high-performance Genio 520/720 IoT platform, the solution offers exceptional scalability and supports on-device large model integration, enabling global retailers to deliver smarter, faster, and more immersive retail experiences.　　Core Hardware Power: High-Performance Edge AI Computing　　Built on an advanced 6nm octa-core processor, the AI ECR provides strong edge AI computing for both traditional and intelligent retail operations.　　Equipped with 2× Cortex-A78 (@2.2GHz) and 6× Cortex-A55 (@2.0GHz) cores plus an NPU 850 delivering up to 10 TOPS, it supports local large language models for voice interaction, inventory forecasting, and visual recognition — minimizing cloud reliance while ensuring faster response and data privacy.　　Immersive Visual & Seamless Connectivity　　The platform supports a 15.6-inch 2K display with 2D/3D acceleration and can drive 4K/5K ultra-HD screens, ideal for digital signage.　　To meet diverse retail needs, it integrates dual-camera input (MIPI CSI + USB) for facial payment and behavior analysis, plus multiple I/O ports (USB-A/C, HDMI, RJ45, RJ12, audio) for peripherals.　　Built-in Wi-Fi 6 (1×1) and Bluetooth 5.3 ensure high-speed, stable wireless connections.　　Powered by Android 15: Secure and Future-Ready　　Among the first to run Android 15, the solution provides an open, secure ecosystem with enhanced multitasking, memory management, and system-level protection—ensuring smooth, long-term performance for industrial and consumer-grade applications.　　“We look forward to continuing our collaboration with Fibocom, leveraging the MediaTek Genio platform to deliver powerful edge AI performance with on-device large model support,” said CK Wang, Vice President and General Manager of MediaTek IoT. “This solution demonstrates our shared commitment to advancing smart retail and helping businesses become more competitive and efficient.”　　Ralph Zhao, General Manager of Mobile Computing Solutions BU at Fibocom, stated:　　“As the retail industry accelerates toward automation and intelligence, edge AI computing has become the key to improving user experience. Fibocom’s new AI ECR solution represents a breakthrough in hardware design and enables large-model applications at the point of sale with 10 TOPS of processing power — empowering partners to build more competitive and intelligent retail solutions.”
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Release time：2026-03-10 16:24 reading：339 Continue reading>>
MWC 2026 | Fibocom and du’s ALL-IN-ONE <span style='color:red'>AI</span> CPE Solution Reinvents Family Data Interaction with <span style='color:red'>AI</span> NAS
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MWC 2026 | Fibocom and du’s ALL-IN-ONE AI CPE Solution Reinvents Family Data Interaction with AI NAS

　　On March 5 at the 2026 Mobile World Congress (MWC), Fibocom and du showcased the upgraded ALL-IN-ONE AI CPE solution featuring an enhanced AI NAS, further integrating 5G, AI and real-life scenarios. The upgrade transforms home storage from passive data retention into active intelligent management, delivering more personalized smart home experiences.　　Fibocom first introduced the ALL-IN-ONE AI CPE at NetworkX in France in October 2025, redefining the traditional 5G CPE form factor. The device integrates intelligent voice interaction, human and environmental sensing, and leverages Fibocom’s proprietary FWA AI SkyEngine to enable multi-scenario applications including smart home network management, home security, and smart home control.　　du positions AI-powered 5G CPE as a key enabler of premium fixed wireless access (FWA) services across residential, SME and enterprise markets in the UAE. By emphasizing intelligent self-optimization, ultra-low latency, high reliability and simplified deployment, du aims to deliver consistent gigabit connectivity while supporting cloud services, gaming and smart digital experiences.　　The latest upgrade significantly enhances home data management. Powered by SkyEngine computing capabilities, the built-in AI NAS allows users to quickly locate photos by entering keywords, eliminating the need to manually search large file libraries. The system can also detect duplicate photos and notify users to free up storage space efficiently.　　Natural voice interaction further simplifies the experience. Users can search content through voice commands, such as requesting “family photos from last summer at the beach,” while the AI NAS automatically categorizes photos by location, time, people and themes to generate personalized digital albums.　　All photo recognition and retrieval are processed locally through edge AI to ensure privacy and data security, supported by a physical privacy switch. The CPE also supports HDMI output, allowing users to display photos on larger screens via voice commands, enhancing shared family experiences.　　By integrating AI NAS, intelligent interaction and network optimization, the ALL-IN-ONE AI CPE continues evolving from traditional communication hardware into a full-scenario intelligent home hub, helping operators accelerate the shift toward platform-based services in the 5G FWA ecosystem.
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Release time：2026-03-10 16:21 reading：374 Continue reading>>
Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
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Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.　　In the age of software-defined vehicles (SDVs), automotive SoCs require advanced performance to run multiple applications simultaneously and must offer scalability through chiplets. They must also meet the functional safety requirements of automotive SoCs. As multi-domain SoCs powering central computing are growing larger and more complex, maintaining automotive-grade quality is becoming more difficult. With increased performance in advanced SoCs, power consumption also rises, making improvements in power efficiency and safety vital. To meet these needs, Renesas has developed the following new technologies.　　1. Chiplet architecture that supports functional safety　　To meet the functional safety requirements of automotive SoCs, Renesas has developed a new, proprietary architecture that supports ASIL D even in a chiplet configuration. By combining the standard die-to-die UCIe interface with a proprietary RegionID mechanism, the architecture prevents interference with hardware resources, even when numerous applications run simultaneously, thereby achieving Freedom from Interference (FFI).　　Conventional UCIe interfaces lack functionality to transmit RegionIDs between dies. Renesas developed a method for mapping RegionIDs into physical address space, encoding them into the UCIe region, and transmitting them. This enables safe access control through the memory management unit (MMU) and real-time cores, and meets functional safety requirements across chiplets. Additionally, by maintaining bandwidth from processors to the memory bus, the UCIe interface was confirmed through testing to achieve a high transmission speed of 51.2 GB/s, approaching the upper limit of intra-SoC transfer speeds. This technology provides both scalability and safety for high-performance automotive SoCs.　　2. Advanced AI processing capabilities and automotive-grade quality　　Automotive-grade quality is vital for SDV systems. Renesas has created a 3 nm SoC design that improves the performance of neural processing units (NPUs) for AI processing, while maintaining automotive-grade quality. In recent years, NPUs have been growing larger, with their area expanding 1.5-fold compared to previous generations. This has led to increased clock latency between shared clock sources and individual circuits. To address this problem, Renesas has redesigned the clock architecture by splitting up clock pulse generators (CPGs), which in past designs were module-level units, and placing mini-CPGs (mCPGs) at the sub-module level. This greatly reduces clock latency and meets timing requirements.　　However, multi-layer mCPGs complicate test clock synchronization, which is critical for achieving zero defects in automotive applications. Renesas has integrated test circuits into the hierarchical CPG architecture and unified the signal path for user clocks and test clocks. The new design also synchronizes upper- and lower-level mCPGs under a single clock source in test mode. This makes unified phase adjustment possible. As a result, Renesas has been able to achieve quality aligned with zero-defect expectations, even for large-scale SoCs, providing the high reliability required for next-generation SDV automotive SoCs.　　3. Advanced power control and monitoring for improved power efficiency and safety　　To achieve the high level of performance required for automotive SoCs with improved power efficiency and safety, Renesas has developed advanced power gating technology that uses over 90 power domains. It enables precise power control, from several milliwatts to several tens of watts, depending on operating conditions. Furthermore, Renesas has split power switches (PSWs) into ring PSWs and row PSWs to reduce IR drops (voltage drops) associated with increasing current density from smaller process geometries. When power is turned on, the ring PSW suppresses rush currents. Then the row PSW equalizes impedance within the domain. Together, these reduce IR drops by roughly 13% compared with conventional designs.　　To meet ASIL D functional safety standards, the dual core lock step (DCLS) configuration controls the master and checker cores with independent power switches and controllers. With this design, even if one side fails, the failure can be detected through lockstep operation. Furthermore, loopback monitoring is performed for each PSW's gate signal, so OFF states are detected when a failure occurs. A digital voltage meter (DVMON), which is highly resistant to temperature drift, is used for voltage monitoring. This improves aging tolerance by 1.4 mV. These technologies enable high-performance automotive SoCs that offer both power efficiency and safety.　　These new technologies are being used in Renesas' R-Car X5H SoC for automotive multi-domain ECUs. With R-Car X5H, users can accelerate the evolution of SDVs while ensuring safety and enabling autonomous driving, digital cockpit and more.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2026-02-28 15:45 reading：401 Continue reading>>
Fibocom Launches <span style='color:red'>AI</span> Dongle to Transform Edge <span style='color:red'>AI</span> Experiences
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Fibocom Launches AI Dongle to Transform Edge AI Experiences

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, has unveiled its innovative AI Dongle. The device delivers mobile AI computing power to personal PCs, NAS devices, and other terminals, supporting real-time on-device LLM inference for applications like Q&A assistants, text-to-image search, and meeting summarization.　　Plug-and-Play AI Experience　　The AI Dongle addresses key challenges for edge devices, including real-time inference, data privacy, and energy efficiency. USB-powered, compact, and driver-free, it delivers a true plug-and-play experience on any USB-enabled device. By processing data locally, sensitive information remains on-device, making it ideal for privacy-focused scenarios such as smart meetings and personal assistants. Built on the Qualcomm® QCS6490 processor, the AI Dongle supports a wide range of tasks, from lightweight AI workloads to complex large-model inference.　　Fibocom’s proprietary AI Stack empowers developers to access popular models via OpenAI APIs, enabling seamless integration of on-device AI capabilities with minimal configuration.　　Empowering Devices from PCs to NAS　　Plugged into any standard PC USB port, the AI Dongle delivers powerful AI capabilities for applications like smart meeting systems, supporting offline multi-language translation and automatic meeting summaries.　　For developers, it lowers the barrier to entry—no expensive AI workstations are needed. Creative professionals can accelerate AI-powered plugins for image processing, video editing, and more.　　Paired with NAS devices, the AI Dongle adds dedicated AI computing to centralized storage. This combination is ideal for smart home and safety applications, enabling real-time analysis of local video for facial recognition and behavior detection while protecting data privacy. For small and medium-sized enterprises, it offers secure, efficient content management, supporting tasks like document analysis and intelligent categorization. In research and edge computing, it provides a local processing platform that reduces cloud dependency, latency, and costs.　　Flexible Expansion for Developers　　Fibocom currently offers two demo applications—knowledge Q&A and audio/video transcription—and plans to launch local knowledge-base solutions soon. The AI Dongle will also support open-source agent frameworks, including Tencent Youtu-Agent, streamlining AI application development and accelerating deployment.　　Willson Liu, General Manager of Fibocom AIS Business Unit, said:　　“The AI Dongle will accelerate AI adoption across intelligent devices, offering a portable, user-friendly, scalable AI+ solution. Fibocom is committed to collaborating across the edge AI ecosystem to explore diverse computing solutions and drive intelligent upgrades across industries.”
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Release time：2026-02-03 17:01 reading：499 Continue reading>>
T<span style='color:red'>AI</span>YO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup
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TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup

　　TAIYO YUDEN CO., LTD. has commercialized 14 items, including the multilayer metal power inductor MCOIL™ "LACNF1608KKT1R0MAB" (1.6 x 0.8 x 1.0 mm, maximum height shown), which complies with the "AEC-Q200" certification reliability test standard for passive automotive components.　　The new product is approximately 49% smaller than our previous product, the "LACNF2012KKT1R0MAB" (2.0 x 1.25 x 1.0 mm), and can contribute to the miniaturization and higher performance of power supply circuits installed in automobiles.　　These products are used as choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2025. Samples are available for 50 yen per unit.　　Background　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller in order to arrange devices in highly dense configurations and integrate them into single modules. Furthermore, since ECUs are increasingly being installed in engine compartments--a high temperature environment--on-board electronic components must be able to withstand high temperatures.　　In response, TAIYO YUDEN has added a new 1608 size to its MCOIL™ LACN series of multilayer metal power inductors, which boast the advantages of being smaller and thinner, and having an operating temperature range of -55°C to +165°C. Our proprietary metal materials are bonded to each other by an oxide film using heat treatment, ensuring insulation and providing high heat resistance and thermal conductivity. Thanks to these features, the product exhibits stable characteristics, is able to withstand high temperatures, and achieves high reliability, even in devices used in harsh temperature environments such as automotive applications.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　■Application　　Choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters　　* Derating of rated current is necessary depending on the ambient temperature.　　Please see our website below for detailed specifications.　　LACN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?cid=L&u=M&Seri=LACN_A&SR2=LM%2CMP　　LCCN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?SR6-L=AP2&Ind=1000.0%3A1500.0&Current_Srch=%3A1.9&pg=1&pn=L*CNF&cid=L&u=M　　* "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
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Release time：2026-01-08 15:22 reading：767 Continue reading>>
Renesas丨Silicon to Software: RoX <span style='color:red'>AI</span> Studio Advances Software-Defined Vehicle Design
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Renesas丨Silicon to Software: RoX AI Studio Advances Software-Defined Vehicle Design

　　Software-defined vehicles (SDV) are upending traditional automotive design. While vehicle development is still highly iterative, the industry is in the throes of a historic transformation where manufacturers are compressing once-sequential hardware-to-software design cycles into more efficient software-first design flows.　　This so-called shift-left approach is exemplified by Renesas' adoption of digital tools and AI models as part of a broader digitalization and software strategy aimed at accelerating design and innovation, while simultaneously optimizing R&D efficiency. In the automotive sector, the evolution is driven by practical considerations given that a typical vehicle now embeds more than 100 million lines of code. Heavier software dependence requires continuous updating and deployment, multi-supplier integration, design validation at scale, and reflects an ecosystem where OEMs insource more software and chipmakers ship platforms, not parts. Renesas anticipated these changes with the scalable R-Car hardware and software development platform. R-Car supports the transition of E/E designs to more central processing architectures, including advanced driver assistance systems (ADAS) and autonomous vehicle design. Last year, we added R-Car Open Access (RoX), an extended platform for SDVs that provides a pre-integrated, out-of-the-box environment with hardware, operating systems, software stacks, and tools to accelerate next-generation vehicle development.　　R-Car leverages a heterogeneous architecture that features Arm® CPUs with multiple hardware accelerators. RoX includes a common set of toolchains that allows software reuse across electronic control units (ECUs) for ADAS, in-vehicle information (IVI) systems, and centralized data gateways. By enabling cloud-native development and customized design simulation, the RoX platform expands SDV lifecycle support through continuous updates that align with a modern value chain where OEMs and service providers increasingly co-own software.　　Introducing RoX AI Studio: Cloud-Native MLOps on R-Car　　Many of our automotive customers have embraced R-Car and the Renesas RoX platform as a means to accelerate SDV development and manage the complexity of in-vehicle embedded processing systems. In doing so, we found a persistent "lab-to-road" gap between how designers employ AI training in the cloud and how they deploy new features in automotive SoCs.　　RoX AI Studio, a new extension of the original RoX platform, closes that gap. The machine learning operations (MLOps) tool lets teams remotely evaluate AI models using a managed cloud control plane that connects engineers with hardware-in-the-loop (HIL) device farms so they can profile real-world performance without waiting for scarce lab boards. Continuous integration and deployment (CI/CD) keeps the full toolchain current, so improvements arrive automatically with no local installs required. The result is faster iteration, fewer surprises, and a direct line from model training to road-ready, HIL model validation.　　What Is MLOps – and How Does RoX AI Studio Enable It for SDVs?　　To define MLOps, it's important to understand what preceded it. MLOps builds on a concept called DevOps – short for development operations – in which tools and best practices are combined to shorten software design lifecycles. This is achieved by breaking down silos between development and IT operations teams to help them collaborate more effectively.　　DevOps governs deterministic integrate/test/deploy processes for conventional software code and services. MLOps adds AI data and models, where development lifecycles are iterative, experiments branch, and choices must be tracked, compared, and promoted. By anchoring model validation on R-Car silicon, RoX AI Studio becomes the bridge between model-in-training and model-in-production, turning the art and science of AI model development into repeatable and scalable engineering operations with targeted KPIs.　　RoX AI Studio operationalizes automotive MLOps for SDVs in several ways:　　Model Intake and Registry: Renesas provides a curated model zoo that includes many popular AI models. Users can also use a bring your own model (BYOM) approach to ingest their own custom or proprietary models and receive a quick performance evaluation on R-Car silicon.　　Automated Updates: Orchestration workflows in our MLOps tool simplify the user experience by abstracting model processing for silicon deployment, while CI/CD toolchains automate the release and deployment of the latest version of the AI toolchain for R-Car SoCs.　　HIL Evaluation: MLOps in the cloud connects to a physical lab hosting an array of R-Car silicon devices that run inference experiments on demand. This allows remote validation of AI models without requiring physical co-location with the hardware.　　Results and Artifacts: Collects metrics and logs from inference experiments and aggregates them as metric comparison tables and plots.　　Scaled Experimentation: Runs multiple models/variants in parallel to compare accuracy vs. latency under real-world operating constraints.　　Flexible Deployment: Will allow designers to begin on the Renesas cloud for speed and then mirror the same stack later in a private cloud when silicon is more widely available for individual projects.　　RoX AI Studio Is Advancing Automotive's "Shift Left" Strategy　　Automotive timelines are compressing. Manufacturers are moving from three to four-year platform development cycles to one to two-year cycles augmented by ongoing over-the-air (OTA) updates to provide on-road product feature enhancements. That means design teams adopting the shift-left philosophy need to test hardware and software earlier using target (remote or virtual) devices.　　That's a challenge for OEMs, many of which have invested heavily in AI model training and are striving to continuously improve their networks by deploying feature updates to their vehicles in the field. At the same time, shorter development cycles mean they must test many device options simultaneously – at scale and across multiple vectors – without over-investing in the wrong development path.　　When OEMs and Tier 1 suppliers use RoX AI Studio, they can quickly validate their devices by testing at scale and within the context of their specific MLOps network strategy. RoX AI Studio makes this practical by creating a simplified developer experience for managing cloud-to-lab infrastructure and automated workflows for pre-trained model deployment and evaluation on R-Car SoC targets. It runs experiments in parallel, as opposed to serially, and provides access to device farms that allow global teams to start development before boards arrive and continue at scale.　　For automotive OEMs, this means earlier starts and fewer late surprises, reusable software investments that move from cloud to vehicle, and a clean path to private-cloud deployment and virtual platforms that yield better results and shorten time to market.　　Platform Thinking for the Software-Defined Era　　Car makers designing SDVs are committed to developing hardware and software in parallel, and the market is converging on cloud-native machine learning tools – but with no universal MLOps winner yet.　　Renesas RoX AI Studio provides a standardized SDV design foundation and operationalizes AI development on that foundation by moving beyond DevOps to support a "one-stop studio" model. Together, the RoX platform and RoX AI Studio are enabling a shift-left culture change: validate earlier, iterate faster, deploy confidently.　　Renesas RoX AI Studio is currently available to select customers with a broad introduction planned in 2026.
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Release time：2025-12-31 17:27 reading：1166 Continue reading>>
Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform
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Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.　　Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the R-Car Open Access (RoX) Whitebox Software Development Kit (SDK) as part of the next phase of development. Renesas is also driving deeper collaboration with customers and partners to accelerate adoption. At CES 2026, Renesas will showcase AI-powered multi-domain demonstrations of the R-Car X5H in action.　　The R-Car X5H leverages one of the most advanced process nodes in the industry to offer the highest level of integration, performance and power efficiency, with up to 35 percent lower power consumption than previous 5nm solutions. As AI becomes integral to next-generation SDVs, the SoC delivers powerful central compute targeting multiple automotive domains, with the flexibility to scale AI performance using chiplet extensions. It delivers up to 400 TOPS of AI performance, with chiplets boosting acceleration by four times or more. It also features 4 TFLOPS equivalent* of GPU power for high-end graphics and over 1,000k DMIPS powered by 32 Arm® Cortex®-A720AE CPU cores and six Cortex-R52 lockstep cores with ASIL D support. Leveraging mixed criticality technology, the SoC executes advanced features in multiple domains without compromising safety.　　As hardware and software become more tightly integrated early in development to support complex E/E architectures, Renesas is adding new capabilities to the RoX development platform. RoX dramatically simplifies development by combining all essential hardware, operating systems, software and tools required to rapidly develop next-generation vehicles with seamless software updates.　　Accelerating Automotive Innovation with an Open, Scalable RoX Whitebox SDK　　To accelerate time-to-market, Renesas now offers the RoX Whitebox Software Development Kit (SDK) for the R-Car X5H, an open platform built on Linux, Android, and XEN hypervisor. Additional support for partner OS and solutions is available, including AUTOSAR, EB corbos Linux, QNX, Red Hat and SafeRTOS. Developers can jumpstart development out of the box using the SDK to build ADAS, L3/L4 autonomy, intelligent cockpit, and gateway systems. An integrated stack of AI and ADAS software enables real-time perception and sensor fusion while generative AI and Large Language Models (LLMs) enable intelligent human-machine interaction for next-generation AI cockpits. The SDK integrates production-grade application software stacks from leading partners such as Candera, DSP Concepts, Nullmax, Smart Eye, STRADVISION and ThunderSoft, supporting end-to-end development of modern automotive software architectures and faster time to market.　　“Since introducing our most advanced R-Car device last year, we have been steadfast in developing market-ready solutions, including delivering silicon samples to customers earlier this year,” Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “In collaboration with OEMs, Tier-1s and partners, we are rapidly rolling out a complete development system that powers the next generation of software-defined vehicles. These intelligent compute platforms deliver a smarter, safer and more connected driving experience and are built to scale with future AI mobility demands.”　　“Integrating Renesas’ R-Car X5 generation series into our high-performance compute portfolio is a natural next step that builds on our existing collaboration,” said Christian Koepp, Senior Vice President Compute Performance at Bosch’s Cross-Domain Computing Solutions Division. “At CES 2026, we look forward to showcasing this powerful solution with Renesas X5H SoC, demonstrating its fusion capabilities across multiple vehicle domains, including video perception for advanced driver assistance systems."　　“Innovative system-on-chip technology, such as Renesas’ R-Car X5H, is paving the way for ZF’s software-defined vehicle strategy,” said Dr. Christian Brenneke, Head of ZF’s Electronics & ADAS division. “Combining Renesas’ R-Car X5H with our ADAS software solutions enables us to offer full-stack ADAS capabilities with high computing power and scalability. The joint platform combines radar localization and HD mapping to provide accurate perception and positioning for reliable ADAS performance. At CES 2026, we’ll showcase our joint ADAS solution.”　　First Fusion Demo on R-Car X5H with Partner Solutions at CES 2026　　Renesas will showcase the capabilities of the R-Car X5H for the first time through a series of invitation-only demos at CES 2026. For more information about how to attend this event, contact sales at: CES26_Info@lm.renesas.com.　　The new multi-domain demo upscales from R-Car Gen 4 to the next-generation R-Car X5H on the RoX platform, integrating ADAS and IVI stacks, RTOS, and edge AI functionality on Linux and Android with XEN hypervisor virtualization. Supporting input from eight high-resolution cameras and up to eight displays with resolutions reaching 8K2K, the platform delivers immersive visualization and robust sensor integration for next-generation SDVs. Combined with the RoX Whitebox SDK and production-grade partner software stacks, the platform is engineered for real-world deployment covering multiple automotive domains.　　Availability　　Renesas is shipping R-Car X5H silicon samples and evaluation boards, along with the RoX Whitebox SDK, to select customers and partners.
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Release time：2025-12-24 16:06 reading：1404 Continue reading>>
ROHM launches wide SOA MOSFET for <span style='color:red'>AI</span> servers in compact 5×6mm package
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ROHM launches wide SOA MOSFET for AI servers in compact 5×6mm package

　　ROHM has developed the 100V power MOSFET - RS7P200BM - achieving industry-leading SOA in a 5060-size (5.0mm × 6.0mm) package. This product is ideal for hot-swap circuits in AI servers using 48V power supplies as well as for industrial power supplies requiring battery protection.　　The rapid evolution and widespread adoption of AI technologies have increased the demand for stable operation and improved power efficiency in servers equipped with generative AI and high-performance GPUs. Particularly in hot-swap circuits, power MOSFETs with wide SOA are essential to handle inrush current and overload conditions, ensuring stable operation. Furthermore, within data centers and AI servers, the transition towards 48V power supplies, which offer superior power conversion efficiency, is progressing against a backdrop of energy conservation. This necessitates the development of high-voltage, high-efficiency power supply circuits capable of meeting these demands.　　Therefore, ROHM has expanded its line-up of 100V power MOSFETs ideal for hot-swap circuits in AI servers to meet market demand. The new RS7P200BM adopts a compact DFN5060-8S (5060 size) package, enabling even higher density mounting compared to the AI server power MOSFET ‘RY7P250BM’ in the DFN8080-8S (8.0mm × 8.0mm size) package, which ROHM has released in May 2025.　　The new product achieves a low on-resistance (RDS(on)) of 4.0mΩ (conditions: VGS=10V, ID=50A, Ta=25°C) while maintaining wide SOA of 7.5A at a pulse width of 10ms and 25A at 1ms under operating conditions of VDS=48V. This balance of low on-resistance and wide SOA, typically a trade-off relationship, helps suppress heat generation during operation, thereby improving server power supply efficiency, reducing cooling load, and lowering electricity costs.　　Mass production of the new product began in September 2025 (sample price: $5.5/unit, excluding tax).　　ROHM will continue to expand its product lineup for 48V power supplies, which are increasingly adopted in applications such as AI servers. By providing highly efficient and reliable solutions, we will contribute to reducing power loss and cooling loads in data centers, as well as enhancing the high reliability and energy efficiency of server systems.　　Application Examples　　•48V system AI servers and data center power hot-swap circuits　　•48V system industrial power supplies (forklifts, power tools, robots, fan motors, etc.)　　•Battery-powered industrial equipment such as AGVs (Automated Guided Vehicles)　　•UPS, emergency power systems (battery backup units)　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector. Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　・EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　SOA(Safe Operating Area)　　The voltage and current range within which a device can operate safely without damage. Operation beyond this safe operating area may cause thermal runaway or damage; therefore, consideration of the SOA is essential, particularly in applications where inrush current or overcurrent may occur.　　Hot-swap circuit　　The complete circuitry supports the hot-swap function, which enables the removal or insertion of components while the device's power supply remains active. Comprising MOSFETs, protective elements, and connectors, it suppresses inrush currents occurring during component insertion and provides overcurrent protection, thereby ensuring the safe operation of the system and connected components.　　Inrush Current　　The high current exceeds the rated current value that flows momentarily when switching on electronic equipment. Controlling this prevents damage to devices and stabilizes the system by reducing the load on components within the power supply circuit.　　On-resistance(RDS(on))　　The resistance value between the drain and source terminals when the MOSFET is in operation (on). The lower the value, the less power loss occurs during operation.
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Release time：2025-11-28 17:28 reading：1162 Continue reading>>

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